Article is about research by IMEC (a chip packaging company) into dealing with the heat problems encountered with stacked dies such as HBM memories with a GPU.
You have to get a third of the way in before they really get to the topic.
That’s not what IMEC is : “Interuniversity Microelectronics Centre is an international research & development organization, active in the fields of nanoelectronics and digital technologies” and it’s a non profit. They basically do research for and with the semi industry.
Article is about research by IMEC (a chip packaging company) into dealing with the heat problems encountered with stacked dies such as HBM memories with a GPU.
You have to get a third of the way in before they really get to the topic.
That’s not what IMEC is : “Interuniversity Microelectronics Centre is an international research & development organization, active in the fields of nanoelectronics and digital technologies” and it’s a non profit. They basically do research for and with the semi industry.
Ok. I’m not familiar with them. I was just relaying my impression from the start of the article.
No worries, it’s a very niche thing.
I work in the semiconductor industry, but have little to do with physical aspects.