Article is about research by IMEC (a chip packaging company) into dealing with the heat problems encountered with stacked dies such as HBM memories with a GPU.
You have to get a third of the way in before they really get to the topic.
IMEC (a chip packaging company)
That’s not what IMEC is : “Interuniversity Microelectronics Centre is an international research & development organization, active in the fields of nanoelectronics and digital technologies” and it’s a non profit. They basically do research for and with the semi industry.
Ok. I’m not familiar with them. I was just relaying my impression from the start of the article.
No worries, it’s a very niche thing.
I work in the semiconductor industry, but have little to do with physical aspects.
Cooked chips…
Seems normal tbh
Tech for corpos only, like HBM. Not interested.
